News summary
[Jingfang Technologycrashbandicoot2007: Glass substrate independently developed by the companycrashbandicoot2007, has many years of mass production experience in Fanout and other packaging processes] Securities Times e Company News, Jingfang Technology (603005) stated on the interactive platform on May 23 that the company focuses on wafer-level packaging technical services in the sensor field. TSV, TGV, etccrashbandicoot2007.crashbandicoot2007..
Newsletter text
[Jingfang Technology: The glass substrate independently developed by the company has many years of experience in mass production in Fanout and other packaging processes] Securities Times e Company News, Jingfang Technology (603005) stated on the interactive platform on May 23 that the company focuses on Wafer level packaging technology services in the sensor field. TSV, TGV, etc. are the main technical processes for wafer-level packaging electrical interconnection. Combined with sensor needs and its own process accumulation, the company has diversified glass processing technologies, including the production of microstructures, optical structures, coatings, through holes, blind holes, etc., and the company's independently developed glass substrates have been used in Fanout and other packaging processes. Years of mass production experience.